| 摘要 |
A novel electrical connector and fixture for surface mounted leaded chip carriers, particularly for quad pack integrated circuit packages. The fixture includes a rectangular frame that supports the leads extending from the four sides of the integrated circuit package. The connector includes a plurality of contact members securely mounted in an outer housing member. The contact members have flexible contacting portions arranged for registration with the leads. Each contacting portion projects slightly from and is surrounded by an insulating wall that protects the contacting portions from touching each other when they are subjected to an axial buckling stress. The ends of the contact members opposite the contacting portions project from the outer housing member sufficiently separated for connection with other apparatus such as a test probe, electrical connector, etc. The outer housing member slides on an inner support member along an axis generally perpendicular to the IC package with which the connector is used. The inner support member includes registration pins that engage a registration index on the fixture. The outer housing member is urged towards the IC package to establish electrical contact between the leads and contact members. The connector applies force to the leads substantially perpendicular to the leads where they are supported by the fixture. A latch mechanism is provided to hold the connector engaged with the IC package.
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