Thermosetting compositions and molding method

摘要

A thermosetting resin containing composition can be heated to reduce its viscosity and used as a liquid in a liquid injection molding method. It has a phenolic resin content of about 80% to about 90% solids by weight, and contains about 5% to about 40% of a polyglycol. The composition may also contain resorcinol as a compatibilizing agent and a polyalkylene glycol as the polyglycol agent. In a novel method the resin containing composition is heated to reduce its viscosity and introduced into a heated mold in a liquid injection molding method.