Self-mounted chip carrier

摘要

A self-mounted chip carrier having a surface which contains the integrated circuit. This surface has a contact pad metallized area for contacting the integrated circuit. The self-mounted chip carrier is secured to a mating surface and aligned so that the pads on the chip carrier are aligned with the matching pads on a substrate for mating with the self-mounted chip carrier. Registration holes serve as a means for aligning the chip carrier. A compliant connector made of an elastomeric material is positioned between the chip carrier and the substrate to provide electrical connection. A lid is provided to serve as a deflection stop.