| 摘要 |
A cavity or hollow-type package (8) for optically and nonoptically active semiconductor devices is entirely made with moldable plastic material by utilizing a preformed box-like shell (4) of a rigid plastic material for enclosing the semiconductor die (1) and the electrical connection wires (2a,2b) before molding the whole in an epoxy resin. The protection shell is composed by two matching halves (4a,4b) and, in the case of optically active devices, the top half of the shell is provided with a window closed by a transparent pane which is sealed during the encapsulation. Preferably the two halves of the protection shell have two spaced lateral walls (7a,7a',7b,7b') forming two spaced sealing perimeters and an auxiliary perimetral chamber (5) therebetween surrounding a central cavity (6) of the shell for accommodating any encapsulating resin which may eventually extrude through the outer sealing perimeter during molding. The central cavity of the shell may be filled with a nonrigid silicone resin before molding for increasing further the protection. The entirely plastic hollow package may be formed through a normal plastic molding process. |
