| 摘要 |
<p>PURPOSE:To reduce an attenuation of a signal to a minimum at an external lead terminal by a method wherein an insulating container is formed of a specific sintered substance and the external lead terminal is formed of a metal in which copper sheet having a thickness of a specific range are bonded to a face of a sheetlike specific alloy body. CONSTITUTION:An insulating substrate 1 and a lid body 2 constituting an insulating container which is sealed with glass members 6 for sealing use and which houses a semiconductor element 4 at its inside are formed of an aluminum oxide sintered substance. On the other hand, external lead terminals 5 are formed of a metal body in which copper sheets having a thickness of 15 to 40% with reference to a thickness of a sheetlike invar alloy body are bonded to the surface and the rear surface of the sheetlike body. By this constitution, an attenuation of a signal is reduced to a minimum at the external lead terminals, the signal is inputted to and outputted from the semiconductor element surely, the semiconductor element is operated stably for a long term, and a package for semiconductor-element, which houses the semiconductor element operated at high speed is formed.</p> |
