发明名称 PACKAGE FOR SEMICONDUCTOR-ELEMENT
摘要 <p>PURPOSE:To firmly bond blanks by a method wherein the outer surface of a core body, which is composed of an alloy of Ni and Fe at respectively specific wt.%, of an external lead terminal is covered with a covering layer composed of copper and the terminal is constituted of a metal body in which a cross-sectional area of the covering layer is a specific wt.% of a cross-sectional area of the core body. CONSTITUTION:External lead terminals 5 composed of a conductive material are arranged between an insulating substrate 1 and a lid body 2; the terminals 5 are connected electrically to individual electrodes of a semiconductor element 4 via wires 7; the external lead terminals 5 are connected to an external electric circuit; the semiconductor element 4 is connected to the external circuit. In this case, the insulating substrate 1 and the lid body 2 are covered with at least one kind out of an aluminum nitride sintered substance and a mullite sintered substance. On the other hand, the lead terminals 5 are attached and bonded simultaneously between the substrate 1 and the lid body 2 when glass members 6, for sealing use, applied to opposite main faces of the substrate 1 and the lid body 2 are melted and united and an insulating container 3 is sealed airtightly.</p>
申请公布号 JPH03167850(A) 申请公布日期 1991.07.19
申请号 JP19890308594 申请日期 1989.11.27
申请人 KYOCERA CORP 发明人 MATSUMOTO HIROSHI;IGUCHI MASAAKI
分类号 H01L23/08;H01L23/10;H01L23/50 主分类号 H01L23/08
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