| 摘要 |
The heat dissipator consists of the casing (BO). The mounting takes place in the following order: - the printed circuit with the components AC1, AC2, etc. is fixed to the casing. - the transistor (TR) to be cooled is equipped with a conducting column (COL), and the assembly is inserted into the well (PUI) through the hole (TCI) formed in the printed circuit (CI). -finally the leads (PTR) of the transistor are soldered to the printed circuit (CI). <IMAGE>
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