发明名称 PACKAGE FOR SEMICONDUCTOR-ELEMENT
摘要 PURPOSE:To operate a semiconductor element normally by a method wherein an insulating container is constituted of spinel or the like, an external lead terminal is constituted of a metal whose magnetic permeability, electric conductivity and coefficient of thermal expansion are specific % values or higher and a glass member is constituted of a glass composed of silica and oxides of Na and K at specific rates. CONSTITUTION:Recessed parts which form a space used to house a semiconductor element are formed in respective central parts of an insulating substrate 1 and a lid body 2; the semiconductor element 4 is fixed to the bottom of the recessed part of the substrate 1 via an adhesive such as a resin, a glass, a brazing agent or the like. The substrate 1 and the lid body 2 are formed of spinel or a steatite sintered substance; an insulating container 3 is formed. External lead terminals 5 are constituted of a metal whose magnetic permeability is 200 (CGS) or lower, whose coefficient of thermal expansion is 70 to 85X10<-7>/ deg.C and whose electric conductivity is 50% (IACS) or higher; glass members are constituted of a glass which is composed of the following: 55.0 to 75.0wt.% of silica; 10.0 to 20.0wt.% of at least one kind of oxides of Na and K; and 20.0 to 40.0wt.% of lead oxide.
申请公布号 JPH03167847(A) 申请公布日期 1991.07.19
申请号 JP19890308609 申请日期 1989.11.27
申请人 KYOCERA CORP 发明人 MATSUMOTO HIROSHI;IGUCHI MASAAKI
分类号 H01L23/08;H01L23/10;H01L23/50 主分类号 H01L23/08
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