发明名称 PACKAGE FOR SEMICONDUCTOR-ELEMENT
摘要 PURPOSE:To reduce a noise and an attenuation of a signal to a minimum at an external lead terminal and to operate a semiconductor element normally and stably for a long term by a method wherein prescribed materials are used for an insulating container, the external lead terminal and a glass member for sealing use. CONSTITUTION:An insulating substrate 1 and a lid body 2 which constitute an insulating container 3 are formed of a forsterite sintered substance or a zirconia sintered substance. Glass members 6, for sealing use, applied to opposite main faces of the substrate 1 and the lid body 2 are formed of a glass which is composed of the following: 30.0 to 60.0wt.% of silica; 20.0 to 40.0wt.% of lead oxide; and 10.0 to 20.0wt.% of at least one kind out of oxides of sodium and potassium. In addition, external lead terminals 5 arranged between the substrate 1 and the lid body 2 are formed of a conductive material, whose magnetic permeability is 200 (CGS) or lower, whose electric conductivity is 10% (IACS) or higher and whose coefficient of thermal expansion is 95 to 110X10<-7>/ deg.C.
申请公布号 JPH03167865(A) 申请公布日期 1991.07.19
申请号 JP19890308614 申请日期 1989.11.27
申请人 KYOCERA CORP 发明人 MATSUMOTO HIROSHI;IGUCHI MASAAKI
分类号 H01L23/08;H01L23/10;H01L23/50 主分类号 H01L23/08
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