| 摘要 |
<p>PURPOSE:To normally operate an inside semiconductor element by a method wherein an external lead terminal is constituted of a metal body in which copper sheets having a thickness of a specific % with reference to a thickness of a sheetlike body composed of an alloy of Ni, Co and Fe at respectively specific wt.% are bonded to the surface and the rear surface of the sheetlike body. CONSTITUTION:An insulating substrate 1 and a lid body 2 are formed of spinel or a steatite sintered substance. On the other hand, external lead terminal 5 are formed of a metal body in which copper sheets having a thickness of 60 to 80% with reference to a thickness of a sheetlike body composed of an alloy of 31.5 to 32.5wt.% of Ni, 16.5 to 17.5wt.% of Co and 50.0 to 52.0wt.% of Fe are bonded to the surface and the rear surface of the sheetlike body, whose magnetic permeability is about 93 (CGS), whose electric conductivity is 62.3% (IACS) and whose coefficient of thermal expansion is about 71X10<-7>/ deg.C. Thereby, even when an electric current flows to the terminals 5, a large self-inductance is not generated in the terminals, a noise by an electromotive force caused by the self-inductance is reduced to a minimum and a semiconductor inside can be always operated normally.</p> |
