发明名称 PACKAGE FOR SEMICONDUCTOR-ELEMENT
摘要 <p>PURPOSE:To stably operate a semiconductor element inside by a method wherein an external lead terminal is formed of a metal body in which copper sheets having a thickness substantially identical to a thickness of a sheetlike body composed of an invar alloy are bonded to the surface and the rear surface of the sheetlike body. CONSTITUTION:An insulating substrate 1 and a lid body 2 are composed of a forsterite sintered substance or a zirconia sintered substance. External lead terminals 5 are formed of a metal body in which copper sheets, having a thickness substantially identical to a thickness of a sheetlike body composed of an invar alloy, are bonded to the surface and the rear surface of the sheetlike body, whose magnetic permeability is about 133 (CGS), whose electric conductivity is 67.4% (ICAS) or higher and whose coefficient of thermal expansion is about 106X10<-7>/ deg.C. Thereby, even when an electric current flows to the external lead terminals 5, a large self-inductance is not generated in the external lead terminals 5. As a result, a noise by a counter electromotive force caused by the self-inductance can be reduced to a minimum and a semiconductor element inside can be operated stably.</p>
申请公布号 JPH03167855(A) 申请公布日期 1991.07.19
申请号 JP19890308599 申请日期 1989.11.27
申请人 KYOCERA CORP 发明人 MATSUMOTO HIROSHI;IGUCHI MASAAKI
分类号 H01L23/08;H01L23/10;H01L23/50 主分类号 H01L23/08
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