发明名称 PACKAGE FOR SEMICONDUCTOR-ELEMENT
摘要 PURPOSE:To surely input a signal to and output it from a semiconductor element and to stabilize an operation of the element by a method wherein an insulating container and an external lead terminal are formed of prescribed materials in order to reduce a generated noise and an attenuation of the signal to a minimum at the external lead terminal. CONSTITUTION:Recessed parts are formed in respective central parts of an insulating substrate 1 and a lid body 2 constituting an insulating container 3; a semiconductor element 4 is fixed to the bottom of the recessed part in the substrate 1 via an adhesive. Individual electrodes of the semiconductor element 4 are connected, via wires 7, to external lead terminals 5, composed of a conductive material, which are formed between the substrate 1 and the lid body 2. The terminals 5 are formed of a metal body in which copper sheets having a thickness of 40 to 60% with reference to a thickness of a sheetlike body composed of an invar alloy are bonded to the surface and the rear surface of the sheetlike body. As a result, a noise by a counter electromotive force caused by a self-inductance in the terminals 5 is reduced to a minimum, and the element 4 inside can be always operated normally.
申请公布号 JPH03167856(A) 申请公布日期 1991.07.19
申请号 JP19890308600 申请日期 1989.11.27
申请人 KYOCERA CORP 发明人 MATSUMOTO HIROSHI;IGUCHI MASAAKI
分类号 H01L23/08;H01L23/10;H01L23/50 主分类号 H01L23/08
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