| 摘要 |
PURPOSE:To prevent the occurrence of cracks in a package even under the severe conditions such as in solder mounting by using specific epoxy resin composition containing specific phenol resin. CONSTITUTION:An epoxy resin composition containing the component of a main agent comprising epoxy resin and the component of a hardening agent, a part of which comprises phenol resin expressed by the formula I, is used, and a semiconductor element is sealed. In the formula I, (n) is an integer in the range of 0-15. As the main agent comprising the epoxy resin, bisphenol A-type epoxy resin, novolak-type epoxy resin which is formed by synthesizing various kinds of phenols, bisphenol-type epoxy resin and the like are listed. The phenol resin expressed by the formula I is obtained by the reaction using naphthalene diol and formaldehyde and bonding the naphthalene diol with the formaldehyde. |
