| 摘要 |
PURPOSE:To improve the reliability of connection by forming the shape of the contact part of an aligning layer for a conductor in a through hole in a ceramic substrate for a leadless chip carrier in a smooth, crowing shape. CONSTITUTION:A polishing tape 18 on which abrasive grains are applied is pushed on the surface of a ceramic substrate 4 on which many conductors 11 are provided with a compressing roller 17 comprising an elastic body such as rubber. The tape is being wound, and polishing is performed. An aligning layer 5 is formed on the conductor 11 which has undergone polishing. At this time, the surface of the conductor 5 is smoothly molded in a crowing shape. Therefore, the aligning layer 5 can be attached rigidly without a gap. Thus, the highly reliable leadless chip carrier for a computer module without wire breakdown, short circuits and the like in a conductor part in a through hole can be manufactured. |
