| 摘要 |
<p>PURPOSE: To provide a solder alloy which is usable for base metal-dental alloys and ornamental members by incorporating the specific weight percent of Au, Pd, Ag, Fe, Co, Cu, Sn, Zn, In, Ga, Ge, W, Ir, Ru and Re and specifying the total sum of Sn, Zn, In, Ga and Ge. CONSTITUTION: By weight, 38-70% Au, 6-20% Pd, 8-40% Ag, 1-6% Fe and/or Co, 0-10% Ci, 0-5% Sn, 0-5% Zn, 0-5% In, 0-4% Ga, 0-4% Ge, 0-1% W and 0-1% Ir, Ru and/or Re are incorporated in a solder alloy. At this time, the total sum of contents of Sn, Zn, In, Ga and Ge is made as at least 1% and at most 5%. In this way, the solder alloy for dental members and ornamental members without containing ingredients dangerous for health is provided.</p> |
