发明名称 EQUAL DISTRIBUTION DENSITY PROCESS
摘要 A photograph artwork containing a one to one scale exact image of the circuit pattern to appear on a fabricated printed-wiring board is modified in a predetermined manner. This has the effect of equalizing the amount of metallic conductive circuits on a double sided printed wiring board or panel. The resulting board or panel is plated uniformly on both sides when passed through the electrodeposition cycle of a fabrication process.
申请公布号 EP0176088(B1) 申请公布日期 1991.07.17
申请号 EP19850112136 申请日期 1985.09.24
申请人 BULL HN INFORMATION SYSTEMS INC. 发明人 DOHERTY, JOHN P.;DUFOUR, DAVID L.;GEBO, RUSSELL E.;SULLIVAN, MICHAEL J.
分类号 B41C1/14;G03C5/02;G03F1/00;G03F1/36;G03F9/00;G06F17/50;H01L21/82;H05K3/00;H05K3/10 主分类号 B41C1/14
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