发明名称 |
EQUAL DISTRIBUTION DENSITY PROCESS |
摘要 |
A photograph artwork containing a one to one scale exact image of the circuit pattern to appear on a fabricated printed-wiring board is modified in a predetermined manner. This has the effect of equalizing the amount of metallic conductive circuits on a double sided printed wiring board or panel. The resulting board or panel is plated uniformly on both sides when passed through the electrodeposition cycle of a fabrication process. |
申请公布号 |
EP0176088(B1) |
申请公布日期 |
1991.07.17 |
申请号 |
EP19850112136 |
申请日期 |
1985.09.24 |
申请人 |
BULL HN INFORMATION SYSTEMS INC. |
发明人 |
DOHERTY, JOHN P.;DUFOUR, DAVID L.;GEBO, RUSSELL E.;SULLIVAN, MICHAEL J. |
分类号 |
B41C1/14;G03C5/02;G03F1/00;G03F1/36;G03F9/00;G06F17/50;H01L21/82;H05K3/00;H05K3/10 |
主分类号 |
B41C1/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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