| 摘要 |
<p>A solderable lead is provided for connecting an electrically conductive element (such as a terminal clip, or a connector contact, or a semiconductor chip holder terminal) to a metallic area on a substrate or the like, the solderable lead having a discrete slug of solder mechanically engaged in a special way in a position to be melted for bonding the lead to the metallic area. In one form of solderable lead, a terminal clip portion adapted to be secured to a metallic area on a second substrate is also provided, the terminal clip portion having one or two additional discrete masses of solder mechanically engaged with the clip portion in position to be melted for bonding the clip to one or two metallic areas on the second substrate.</p> |
