| 摘要 |
PURPOSE:To eliminate specific PAD exclusive for testing thereby enabling the chip size to be minimized by a method wherein a bumping metal is separated into multiple parts to be structured in multiple PADs which are melted down by heat treatment after inspection process to be unified into one PAD. CONSTITUTION:A PAD 10 is divided into two rectangles; signal wires are led into the inside of IC; one wire is used for testing the proper functions of IC while the other wire is used for testing PAD. When a heat treatment process called wet back process is performed after finishing the tests, the PADs 10 extend over a central Au/Cr 13 to unify the two PADs 10 completely separated so far. Accordingly, notable cost reduction can be realized by minimizing the chip size and cutting down the test time etc. |
