| 摘要 |
PURPOSE:To enhance a brazed part in joining strength by a method wherein a conductor metal layer out of conductor metal layers, which constitute wiring circuits, forms a brazed wiring circuit, the conductor metal layer concerned is formed of a nickel layer directly formed on a ceramic insulating board, and a wiring circuit other than the wiring circuit formed of the nickel layer is formed of a copper layer. CONSTITUTION:A through-hole 11 and the like are provided to a ceramic insulating board 10 such as an alumina board, and a nickel layer 20 which serves as a first metal layer is formed thereon, which is patterned into a prescribed wiring circuit. An anti-corrosive alloy layer of Ni-P or the like is formed covering all the surface of the nickel layer 20, and then a copper layer 40 of a second conductor metal layer is formed. A terminal pin 50 is arranged on a brazing part of the surface of the nickel layer 20 through the intermediary of a silver brazing material 60 (in this case, through the intermediary of the anti-corrosive alloy layer 30), and when the pin 5 is heated by a conventional heating means, it is joined to the nickel layer 20 through the joining action of the silver brazing material. |
