| 摘要 |
PURPOSE:To improve a multilayered wiring board in electromagnetic shielding properties without lessening it in wiring density by a method wherein an insulated electric wire is buried in a conductive resin layer or sandwiched between a conductive resin layer and a conductive layer or a metal layer so as to surround the insulated electric wire with a conductive material. CONSTITUTION:A multilayer printed wiring board is composed of basic components such as an inner circuit board 1, an adhesive layer 2, a conductive resin layer 3, an insulated electric wire 4, through-holes, and a clearance 6, and a conductive resin layer, a clearance metal layer, and an insulating resin layer are added, if necessary. The wiring board is manufactured as follows: the adhesive layer 2 is formed on the surface of the inner circuit board 1 provided with a ground layer 12 and/or a power supply layer 13; the conductive resin layer 3 is formed on the surface of the adhesive layer 2, and the clearance 6 is provided to a part of the resin layer 3 where a through- hole 51 not connected to the resin layer 3 is provided; the insulated electric wires 4 are fixed to the surface of the resin layer 3 in a required pattern and thermocompressed to be intruded into the resin layer 3; and a through-hole 52 connected to the insulated electric wire 4 and a through-hole not connected to the insulated electric wire 4 but connected to the conductive resin layer 3 are formed. |
