发明名称 LAMINATED PRINT COIL STRUCTURE
摘要 <p>A laminated printed coil structure comprising a wiring board having an insulating substrate, lead terminals and connecting pad portions connected to the lead terminals and formed on one surface of the insulating substrate, and a plurality of printed coil elements each having an insulating layer, coil patterns, a pair of terminals for the coil patterns and a connecting pad electrically isolated from the terminals formed on the insulating layer. The printed coil elements are piled up and laminated on the wiring board such that the connecting pad portions of the wiring board, the terminals of the coil patterns on one of the printed coil elements and the connecting pad on another printed coil element are placed in alignment, and that each one terminal for the coil pattern on each of the printed coil elements to a respective lead terminal is connected, and that each coil pattern is from then led out to the lead terminals of the wiring board.</p>
申请公布号 EP0236763(B1) 申请公布日期 1991.07.17
申请号 EP19870101826 申请日期 1987.02.10
申请人 SONY CORPORATION 发明人 SAWA, KENJI O.;MURAMOTO, SHIYOUICHI;WATANABE, YOSHIO;KAWAHARA, TAKANORI;KOIZUMI, TAKAAKI
分类号 H01F5/00;H02K3/26;H02K3/50;H02K5/22;H05K1/14 主分类号 H01F5/00
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