| 摘要 |
<p>PURPOSE:To enable a semiconductor device to be improved in mounting density and to be easily wired by a method wherein the electrode terminals of an upper and a lower chip are individually or commonly used and connected to the inner leads of a lead frame of a base material by wiring. CONSTITUTION:A chip 1 is larger than a chip 2 in planar area, and power supply terminals 4 are arranged on the planer peripheral part of the chip 1, so that the chips 1 and 2 can be constituted in one piece by bringing the chip 2 into close contact with the chip 1 and made very small in housing area. At bonding, the electrode terminals 4 and 5 can be individually or commonly connected to inner leads 6, so that the wiring of a semiconductor device of this design can be easily and orderly made.</p> |
