PACKAGING A SEMICONDUCTOR CHIP DEVICE

摘要

Heat generated by a semiconductor chip device (10) mounted on a substrate (14) is dissipated through thermally conductive wires (36) which are welded to the device and to a thermally conductive cover (20) disposed over the device. The wires can be of annealed aluminium and ultrasonically welded to heat generating locations on the device and to a part (54) of the cover which is electrically isolated from the remainder of the cover.