| 摘要 |
An electric circuit assembly (212) includes a ceramic tub (214) having a substrate floor (216) and an integral side wall (218) around the perimeter thereof and extending upwardly therefrom and having an integral lower wall (270) extending downwardly therefrom. The lower wall (270) is multi-partitioned and includes dividing wall portions (286, 288) providing electrical isolation and preventing sparking or voltage crossover between lead frames (220, 222, 224). The lower multi-partitioned wall also includes an outer peripheral portion (290) generally defining a chamber between the substrate (216) and a lower substrate (226) and enclosing the space between the substrates and encompassing recesses (274, 276, 278) defined in the lower surface of the upper substrate by central inner partitioned wall portions (286, 288, 292, 294). Copper lead frames (220, 222, 224) have pad portions (220a, 222a, 224a), received in respective recesses below respective apertures (240, 242, 244) through the upper substrate (216). A semiconductor chip (238) is connected to the lead frames through the apertures in the substrate.
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