LIQUID-SEALED SEMICONDUCTOR DEVICE

摘要

PURPOSE:To eliminate restrictions on the fitting direction of a package and to obtain high airtightness in severe use environment by providing a deformable part in an airtightly sealed package and filling the package with liquid. CONSTITUTION:A detecting element 5 is mounted on a cantilever 4 which has weld zones 21a and 22a at its outer peripheral part and the package consists of a base 21 where lead terminals 7 are led out and a cap 22 provided with the deformable part 22b. Then the package is filled with the damping liquid 10 and the weld zones 21a and 22a are welded airtightly. Then the expansion and contraction of the damping liquid 10 due to variation in the ambient temperature are conducted by the deformation of the deformable part 22b to reduce an increase and a decrease in pressure due to the expansion and contraction. Therefore, the restrictions on the fitting direction can be eliminated by the device which is joined airtightly and filled with the damping liquid 10 to simplify the manufacture process and reduce the cost.