| 摘要 |
PURPOSE:To automatize mounting and to write data in the stag of production by constituting a diode matrix of surface mounting parts and controlling data write dependent upon the mount position of surface mounting parts by the mount program of an automatic mounting machine. CONSTITUTION:Row wiring patterns R1 to Rm, column wiring patterns C1 to Cl, first electrode patterns 22 provided at equal intervals on row wiring patterns, and second electrode patterns 24 provided at equal intervals on column wiring patterns are provided, and diodes D11 to Dml selectively mounted in accordance with contents of data to be stored are provided between first and second electrode patterns. Mounting or non-mounting of surface mounting diodes D11 to Dml is controlled by the mount program of a chip mounter. That is, mount positions of surface mounting diodes D11 to Dml dependent upon the chip mounter are controlled in accordance with contents of data to be stored in a ROM. Thus, mounting is automatized, and data can be written by the chip mounter in the stage of production of the ROM. |
