| 摘要 |
PURPOSE:To increase the terminals of a device, to prevent electrical short circuits among outer leads and to obviate the defective mounting of the device by reinforcing the mechanical strength of the outer leads by insulating materials and arranging the outer leads at fine pitches. CONSTITUTION:One ends of inner leads 3A of a plurality of leads 3 and the external terminals of a semiconductor pellet 2 are connected by bonding wires 5, and the pellet 2 and the leads 3A are sealed with a resin body 6. Resin insulating materials 4 are mounted among adjacent outer leads 3B projected from the resin bodies 6. According to the constitution, the mechanical strength of the leads 3B is reinforced by the insulating materials 4, and the leads 3B can be disposed at fine pitches. |
