发明名称 ELECTROLESS PLATING PROCESS
摘要 <p>A new process for conducting electroless plating without the necessity for preliminarily corroding the surface of an object, which comprises coating the surface with a solution of a polystyrene elastomer generally used as a heat-fusible adhesive, alone or together with a tackifying resin having a molecular structure similar to that of the elastomer, and forming a metallic layer on the coating film, formed by drying the applied solution, by electroplating. This process can substitute for the conventional electroless plating which has been conducted as a preliminary step of electroplating of synthetic resin and especially aims at applications in the field of electroless plating for preventing electromagnetic interference.</p>
申请公布号 WO1991009985(P1) 申请公布日期 1991.07.11
申请号 JP1990001662 申请日期 1990.12.20
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