| 摘要 |
<p>PURPOSE:To correctly detect in real time whether the thickness of a plate is good by obtaining the measuring position to measure the thickness of the plate based on the information of the position ensuring the plate thickness from a host computor and through correction of the thermal expansion, and measuring the plate thickness at the obtained position. CONSTITUTION:Plate thickness detectors 3a, 3b which detect the thickness of a plate at many points in response to arcuate beams 2a, 2b of radiation are provided in U-shaped moving frames 1a, 1b, respectively. The position of the detectors 3a, 3b is detected by detecting devices 5a, 5b. An operating device 6 continuously operates the width of the plate from the positional information of the frame detected by the detectors 5a, 5b and edge information from the detectors 3a, 3b. On the other hand, a thickness ensuring position from the position of the plate sensors is indicated to the operating device 6 from a host computor 7, so that the thermal expansion is corrected based on the indicated value and the plate width. Since the plate thickness is measured at this measuring position, the thickness can be correctly judged in real time.</p> |
