发明名称 METHOD AND APPARATUS FOR MOUNTING OF CHIPLIKE ELECTRONIC COMPONENT
摘要 PURPOSE:To accurately correct a sucking position by relatively reciprocating the ends of suction heads laterally in a containing recess at a large moving distance, correcting its sucking attitude, relatively reciprocating the end or the head in the recess laterally at a small moving distance, and correcting its sucking position. CONSTITUTION:A chiplike electronic component (a) sucked to the end of a suction head 83 at a crest part is largely inclined by the reciprocating operation of the head 83 initially at a large moving distance shown in Figs. (d) and (e). Thus, the component (a) is rotated at about 45 deg. by the sucking force of the head 83, sucked at its one side face to the end of the head 83, and its attitude is varied. Then, its sucking position is corrected by the reciprocating operation at a small moving distance shown in Figs. (f) and (g). Thus, even a square chiplike electronic component (a) can be accurately aligned similarly to the columnar chiplike component (a).
申请公布号 JPH03160791(A) 申请公布日期 1991.07.10
申请号 JP19890299967 申请日期 1989.11.18
申请人 TAIYO YUDEN CO LTD 发明人 SEKI MASAKAZU;YAMAKI MAMORU;SEKI FUJIO
分类号 B23P19/04;B23P21/00;H05K13/00;H05K13/02;H05K13/04 主分类号 B23P19/04
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