| 摘要 |
<p>PURPOSE:To increase a close contact property of an adhesive layer with a separator, to suppress a bleeding from the adhesive layer and to prevent a wafer from being contaminated by a method wherein an adhesive which has been filtered by using a filter with a mesh size of 20 to 50mum is used. CONSTITUTION:For a film for wafer processing, a base film is coated with an adhesive and is dried; after that, an adhesive layer is sandwiched between synthetic-resin films called separators. For the adhesive layer, an adhesive which has been filtered by using a filter with a mesh size of 20 to 50mum is used. When the mesh size of the filter is coarser than 50mum, it is not possible to remove particles which are sufficient to keep a smooth property of a coating film; when the mesh size of the filter is finer than 20mum, it takes too much time for a filtering operation and operating efficiency becomes bad. Consequently, when the smooth property of the coating film is increased by filtering the adhesive and by removing giant particles in the adhesive, an empty gap can be eliminated between the separators and the adhesive. Thereby, it is possible to suppress bleeding of an adhesive component and to prevent a wafer form being contaminated.</p> |
