| 摘要 |
PURPOSE:To prevent EMI hindrance due to electromagnetic radiation by electrically connecting a metallic surface to the wiring layer of the grounding terminal of a semiconductor integrated circuit chip through several through-holes formed to an insulating layer and shaping the metallic surface as a grounding layer. CONSTITUTION:The whole surface except signal wiring leading-out sections 5a-5e to the outside of the top face of the surface insulating layer 4c of a semiconductor integrated circuit chip 1 is covered with the metallic surface 6 of gold, aluminum, etc., and a plurality of through-holes 7a-7h are bored to the surface insulating layer 4c and an internal insulating layer 4b and the metallic surface 6 is connected electrically to the wiring layer 3 of the internal grounding terminal of the semiconductor integrated circuit chip 1 in order to use the metal 6 as a grounding layer. Signal wiring leading-out sections 5a-5e and external terminals 9a-9d are connected by the small-gage wires 8a-8e of gold, aluminum, etc., respectively in the leading-out of signal wirings to the outside of the semiconductor integrated circuit chip 1. |
