| 摘要 |
PURPOSE:To improve heat resistance by forming a photo-sensitive resin layer at an inner-layer material and forming an outer-layer material into one piece through a resin layer. CONSTITUTION:A photo-sensitive resin layer is provided on each circuit-forming surface of a required number of inner-layer materials. Then, a resin layer other than a circuit part is cured and is allowed to reside and a resin layer on the circuit is eliminated. Then, an outer-layer material is provided in one piece on the upper surface and/or lower surface through a resin layer. The inner-layer material consists of an electrical circuit which is formed on a single-surface or a double-surface metal-clad laminated plate consisting of a resin such as a phenol resin, a cresol resin, an epoxy resin, and a fluoric resin, an inorganic fiber such as glass and asbestos, an organic synthetic fiber such as polyester, a natural fiber such as cotton, and paper base. A photo-sensitive dry film and a UV curing type varnish is used alone or together as a photo-sensitive resin. Individuals such as copper, aluminum, iron, nickel, and zinc or a metal foil consisting of an alloy or a single-side metal clad laminated plate is used as the outer-layer material. |
