发明名称 |
Semiconductor package connecting method, semiconductor package connecting wires and semiconductor devices. |
摘要 |
A method of electrically connecting a semiconductor package to a substrate by using bump contacts formed by heating the tip of an alloy wire and directly joined to aluminum alloy wiring lines, an alloy wire for such a purpose, and a semiconductor device constructed by electrically connecting a semiconductor package to a substrate by such a method. The alloy wire is produced by drawing an alloy material produced by quench solidifying an alloy containing Pb, Sn or In as a principal element, and an additive element or additive elements. The tip of the alloy wire is heated to form a ball to be joined to the aluminum alloy wiring line as a bump contact. The Brinell hardness number of the ball is HB 6 or higher. |
申请公布号 |
EP0435009(A2) |
申请公布日期 |
1991.07.03 |
申请号 |
EP19900122822 |
申请日期 |
1990.11.29 |
申请人 |
TANAKA DENSHI KOGYO KABUSHIKI KAISHA |
发明人 |
OGASHIWA, TOSHINORI, C/O MITAKA FACTORY OF TANAKA |
分类号 |
B23K35/26;B23K35/36;H01L21/60;H01L23/485;H01L23/49 |
主分类号 |
B23K35/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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