| 摘要 |
PURPOSE:To improve the reliability of wire bonding, and to simplify a manufacturing process is a TAB by selectively laminating palladium, a diffusion preventive metal and a metal enabling metallic joining in succession onto the aluminum wiring metal of an electrode forming section. CONSTITUTION:Electroless plating enabling selective laminating is used as a method in which palladium, a diffusion preventive metal and a metal enabling metallic joining are laminated successively onto an aluminum wiring metal. Palladium is limited up to the etching of the oxide film of the aluminum wiring metal. A silicon substrate 1 having a P-N junction is degreased by alcohol, etched in approximately 1000Angstrom by an aqueous solution mainly comprising sulfuric acid, and dipped into a palladium treating liquid at 10 deg.C containing 10mg/l palladium chloride and 0.1% ammonium fluoride. A nickel-phosphorus layer 6 is plated by an electroless plating bath using nickel sulfate and hypophosphorous acid. Lastly, an NiP surface is activated, and a gold layer 7 is plated by a substitutional electroless gold plating solution, thus manufacturing electrode structure. |
