发明名称 AUTOMATIC MOUNTING DEVICE FOR ELECTRONIC COMPONENT
摘要 PURPOSE:To make it possible to apply diffused light to electronic components firmly attracted to a nozzle and carry out proper recognition work without increasing the size of a take out head by installing a first diffusion plate mounting with each take out nozzle, a second diffusion plate mounting with said take out head, and a light source which applys diffused light to both diffused plates from the lateral side. CONSTITUTION:On the bottom of a rotary disk 10 are installed a number of attraction heads 12 which serves as take out heads wherein a plurality of attraction nozzles 11 are installed as nozzles which take out and transfer chip components 4 from a component supply device 7. Acrylic or glass made first diffusion plates 110 is installed respectively around each attraction nozzle 11 and second diffusion plates 111 mounted with the same nozzles 11 are installed thereon. For example, the light of light source bodies 117A and 117B for the diffusion plates 110 is diffused at the side sections 115 and 116 and penetrated through. The attenuation of light is minimum at a middle section 113 and reflected and diffused on the top, thereby repeating reflection and diffusion within the diffusion plates 110 and irradiating light below the diffusion plates 110.
申请公布号 JPH03155699(A) 申请公布日期 1991.07.03
申请号 JP19890257259 申请日期 1989.10.02
申请人 SANYO ELECTRIC CO LTD 发明人 MIZOGUCHI KENJI;AKAISHI TSUNEFUMI
分类号 H05K13/04;B23P21/00;H05K13/08 主分类号 H05K13/04
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