发明名称 |
Hermetic high density interconnected electronic system or other body. |
摘要 |
A body is hermetically sealed by electroplating a hermetic layer over the exterior surface of the body. A high density interconnect structure (100) is hermetically sealed by forming a continuous metal layer (144) over the outermost dielectric layer (160) of the multilayer interconnect structure and by disposing that continuous metal layer in a hermetically sealing relation to the substrate (112) of the high density interconnect structure. A variety of techniques may be used for providing electrical feedthroughs (118) between the interior and exterior of the hermetic enclosure as may a pseudo-hermetic enclosure in those situations where true hermeticity is not required. <IMAGE> |
申请公布号 |
EP0435530(A2) |
申请公布日期 |
1991.07.03 |
申请号 |
EP19900313642 |
申请日期 |
1990.12.14 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
KORNRUMPF, WILLIAM PAUL;EICHELBERGER, CHARLES WILLIAM;WOJNAROWSKI, ROBERT JOHN |
分类号 |
H01L23/02;H01L21/58;H01L23/04;H01L23/10;H01L23/538;H01L23/552;H01L25/065 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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