| 摘要 |
<p>PURPOSE:To eliminate the need for inclination by a jig, etc., of wafer cassette itself by tilting the wafer holding groove of a wafer cassette to a vertical surface so that a wafer is slanted fixedly. CONSTITUTION:Since wafer holding grooves 3 are tilted, wafers 2 in a wafer cassette 1 are brought down positively in the direction of the inclination of the wafer holding grooves 3 regardless of the looseness sections of the wafers 2 in the wafer holding grooves 3 by their own weight. Consequently, when the wafer cassette 1 is transferred, the wafers 2 are not moved in the wafer cassette 1 even dusting the transfer because the wafers 2 are brought down in the fixed direction regardless of the looseness of the wafers 2 in the wafer holding grooves 3 in the wafer holding grooves 3, thus preventing during. The wafers 2 in the wafer cassette 1 are sucked through evacuation by a sucking section 5. When the wafers 2 are sucked by the sucking section 5, the wafers 2 are brought down in the fixed direction without regard to the looseness of the wafers 2 in the wafer holding grooves 3, thus preventing the mistake of suction.</p> |
