发明名称 Semiconductor device and a method of fabricating the same.
摘要 <p>A semiconductor device comprises a semiconductor substrate (1) provided with a collector region (62) a base region (60) and an emitter region (61) in a lateral arrangement. Respective portions having peak impurity concentrations of the collector region and the emitter region are formed within the semiconductor substrate. A method of fabricating a semiconductor device comprises a step of forming a collector region of a second conduction type and a emitter region of a second conduction type in a lateral arrangement in a semiconductor substrate serving as a base region of a first conduction type by using a first mask provided with a pair of openings, and a step of forming heavily doped regions of the second conduction type so as to be connected respectively to the collector region and the emitter region by using a second mask provided with a pair of openings separated from each other by a distance greater than the distance between the openings of the first mask. &lt;IMAGE&gt;</p>
申请公布号 EP0435331(A2) 申请公布日期 1991.07.03
申请号 EP19900125702 申请日期 1990.12.28
申请人 SONY CORPORATION 发明人 GOMI, TAKAYUKI, C/O SONY CORPORATION;NAKAMURA, MINORU, C/O SONY CORPORATION;ANMO, HIROAKI, C/O SONY CORPORATION;OHUCHI, NORIKAZU, C/O SONY CORPORATION;MIWA, HIROYUKI, C/O SONY CORPORATION;KAYANUMA, AKIO, C/O SONY CORPORATION;KOBAYASHI, KOJI, C/O SONY CORPORATION
分类号 H01L29/73;H01L21/331;H01L21/8222;H01L21/8224;H01L27/06;H01L29/08;H01L29/732;H01L29/735 主分类号 H01L29/73
代理机构 代理人
主权项
地址