| 摘要 |
PURPOSE:To obtain a lead terminal correcting device capable of accurately and quickly correcting and processing board connection ends of a number of lead terminals whose respective position varies widely by carrying out deformation processing twice, which comprises a preliminary thrust deformation to the rear of a package and correct thrust deformation to reverse direction after the first thrust direction. CONSTITUTION:An IC is positioned and mounted on a first receiving base 10 which projects from a first mold 9 so that the rear of the IC may be faced upward. An upper mechanism 5 immediately starts descending. When the first receiving base 10 sinks below the first mold 9, its status is maintained. Only the upper mechanism 5 continues its descending while a second receiving base 14 thrusts downward an IC package wherein only a tip of a board connection end 3a is engaged with an opening edge 9a of the first mold 9. As a result, the whole board connection end 3a is preliminarily deformed relatively upward. When the preliminary deformation ends, the upper mechanism rises slightly and returns to its original position so that its state may be maintained. After that, the rise of this first receiving base 10 lifts the IC supported to the first receiving base 10. The board connection end 3a is thrusted relatively downward so that the whole board connection end 3a may be correction-deformed to a specified position parallel to the surface of the package. |
