| 摘要 |
<p>PURPOSE:To reduce the contact area of the rear surface of a wafer with a hand, and to largely decrease adherence of dusts to the rear surface of the wafer when both are ground by providing at least three wafer supporting members of substantially trapezoidal sectional shape and disposed at its longitudinal direction substantially parallel to the moving direction of the hand on the upper surface of the hand. CONSTITUTION:When a wafer 7 is delivered onto a hand 1, it is supported at three fulcra by supporting parts 6b of three wafer supporting members 6, and the hand 1 is moved linearly by a linear motor toward a stopper 10. The wafer 7 slides on the parts 6b from when the periphery 7b of the wafer 7 is brought into contact with the wafer contact surface 16a of a stopper member 16 set at a X position until the hand 1 is stopped, and is corrected to its normal position of a solid line. Since the supporting structure of the wafer 7 is supported in a linear contact by the members 6, the contact area of the rear surface of the wafer 7 with the hand 1 is largely reduced, and the contact surface is parallel to the moving direction of the hand 1. Accordingly, the grinding of the wafer 7 when the wafer 7 is brought into contact with the member 16 to slid does not become plane but become a line, and dusts to be adhered in the case of grinding is remarkably reduced.</p> |
