TAB tape translator for use with semiconductor devices

摘要

A first plurality of contacts are disposed on a first surface of a flexible tape in a pattern matching the pattern of the contacts of a semiconductor die. A second plurality of contacts are disposed on a second surface of the flexible tape in a pattern matching the pattern of the contacts of a substrate. The first and second plurality of contacts are then coupled by conductive lines disposed on the surfaces of the flexible tape and extending through the conductive tape.