Method and apparatus for low temperature integrated circuit chip testing and operation

摘要

Methods and apparatus for lowering integrated circuit (IC) chip ambient temperatures allow a slow IC chip to simulate a faster, functionally equivalent one for design testing purposes when the faster chip is not yet available. The cooling devices employed include a cryogenic chip cooling apparatus, and a novel thermo-electric chip cooling apparatus using a directly water-cooled Peltier effect device attached to the surface of the IC chip.