发明名称 Method of manufacturing a planar semiconductor device having a guard ring structure
摘要 A method of manufacturing a semiconductor device of the "planar" type comprising a highly doped substrate having a doping concentration co and an epitaxial surface layer having a carrier concentration c<co, in which are formed a main pn junction having a depth xj and a structure of floating guard rings. According to the invention, this device also includes between the substrate and the epitaxial surface layer, a second epitaxial layer having a carrier concentration c' such that co>c'>c. This permits the production of devices with different maximum operating voltages using the same configuration of guard rings.
申请公布号 US5028548(A) 申请公布日期 1991.07.02
申请号 US19900544809 申请日期 1990.06.26
申请人 U.S. PHILIPS CORP. 发明人 NGUYEN, MINH-CHAU
分类号 H01L29/73;H01L21/331;H01L21/74;H01L29/06;H01L29/732;H01L29/78;H01L29/861 主分类号 H01L29/73
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