| 摘要 |
PURPOSE:To dismantle without receiving any effect of the surface tension of water even in the case of a diameter expanding semiconductor wafer and also to perform the alignment accurately by notching a flowing water notch part reaching to the adequate position located between the upper face of a wafer mounting base and the upper end face of a wafer takeout edge part on the center side of a wafer alignment edge part. CONSTITUTION:When a water supply is continued, a semiconductor wafer A starts to float uniformly and the water level becomes upper than the lower end of a flowing water notch part 11, water is flowed out with its overflow from the water flowing notch part 11 and a water flowing is caused toward a wafer alignment edge part 10. Accordingly the semiconductor wafer A is horizontally moved in the wafer alignment edge part 10, stopped in a horizontal state with the abutment of the peripheral edge end of the semiconductor wafer on the wafer alignment edge part 10 and the alignment is completed at the position of a semiconductor wafer A'. The upper face of the semiconductor wafer A is sucked by the suction pad equipped on a transfer arm in this state. |
