| 摘要 |
PURPOSE:To efficiently process holes in a large area and high density circuit board by irradiating a defective part of an electrically conductive layer or an insulating layer of a multilayer circuit substrate with laser light after hole processing to carry out modifying processing of the defective part. CONSTITUTION:When there is a defective part 5 in a transferring pattern 12, the board surface is illuminated by light and the reflected light 6 thereof is received by a light receiving element array 7, etc., to obtain a hole pattern, and said hole pattern is compared with a hole pattern of a nondefective to determine the position of the defective part 5. Then, the light from a laser generator 8 is converged by a reflecting mirror 10 and a condenser lens 11 to irradiate each defective part 5 and when the light passes through the hole a nondefective can be obtained. Thus, only the defective parts among collectively processed many holes can be selectively processed so that the irradiation time of the laser can be reduced and the overheating of the board can be prevented. |
