首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
POLYMER BLEND COMPOSITION
摘要
申请公布号
MTP1073(A)
申请公布日期
1991.06.30
申请号
MTP1073
申请日期
1990.11.05
申请人
MINNESOTA MINING AND MANUFACTURING COMPANY
发明人
分类号
主分类号
代理机构
代理人
主权项
地址
您可能感兴趣的专利
COOLING STRUCTURE FOR TURBO COMPRESSOR
ATTACHMENT APPARATUS FOR MISSING BALL USED FOR MANUFACTURE OF SEMICONDUCTOR BGA PACKAGE
METHOD FOR MANUFACTURING OXIDE LAYER OF SEMICONDUCTOR DEVICE
CORE DRILL FOR PROCESSING SLATE
FOLDER TYPE PORTABLE TELEPHONE AND METHOD FOR DISPLAYING DATA THEREOF
METHOD FOR SELLING, CULTIVATING, HARVESTING AGRICULTURAL PRODUCTS AND LIVESTOCK IN CYBER-SPACE BETWEEN FARMHOUSE AND CONSUMER THROUGH INTERNET
DEVICE OF PROVIDING FRAME PULSE FOR COUNTER
HYDRAULIC DRIVING BICYCLE
DEVICE AND METHOD FOR CLEANING FLUX OF SEMICONDUCTOR DEVICE
REFERENCE VOLTAGE GENERATING CIRCUIT
CELLULAR PHONE USING COMPRESSED AUDIO OR VIDEO DATA
PRINT ALIGNMENT METHOD FOR MULTI-FUNCTIONAL INK JET MACHINE
APPARATUS FOR ADJUSTING WATER LEVEL OF DRUM FOR HEAT RECOVERY STEAM GENERATOR
METHOD FOR AUDITING ALARMS OF BASE STATION MANAGER
SEMICONDUCTOR COB PACKAGE
LOCATION SHIFT APPARATUS FOR OUTDOOR UNIT GRILLE FOR AIR CONDITIONER
METHOD FOR PRODUCING BEAN BREAD USING BEAN FLOUR AS MAIN INGREDIENT
THROWING DEVICE
METHOD FOR MANUFACTURING CAPACITOR OF SEMICONDUCTOR DEVICE USING TANTALUM OXIDE LAYER AS DIELECTRIC LAYER
SUBSTRATE STRIP FOR SEMICONDUCTOR PACKAGE OF CHIP SCALE TYPE