发明名称 |
ELECTRONIC DEVICE SEALING RESIN COMPOSITIONS AND SEALED ELECTRONIC DEVICES |
摘要 |
Disclosed herein are electronic device sealing resin compositions containing 100 parts by weight of a thermoplastic resin mixture composed of 25-60 wt.% of a poly(arylene sulfide) and 40-75 wt.% of an inorganic filler; and 1.5-5 parts by weight of an epoxy-modified silicone oil having an epoxy equivalent of 350-1,000 g/eqiv. Also disclosed are electronic devices sealed using such resin compositions.
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申请公布号 |
CA2026801(A1) |
申请公布日期 |
1991.06.29 |
申请号 |
CA19902026801 |
申请日期 |
1990.10.03 |
申请人 |
KUREHA KAGAKU KOGYO K.K. |
发明人 |
SUZUKI, KEIICHIRO;SAKAGUCHI, YASUO |
分类号 |
C08K3/00;C08K5/5435;C08L81/02;H01L23/29;(IPC1-7):C08L81/02;H01L23/06;C09K3/10;C08K5/54 |
主分类号 |
C08K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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