发明名称 PRINTED CIRCUIT AND ITS MANUFACTURE
摘要 PURPOSE: To mount components by thermal compression bonding, without using solder or an anisotropic conductive adhesive by coating a terminal part, which is covered with conductive particles or powder, with an insulating adhesive. CONSTITUTION: The terminal part of a printed circuit board which is covered with conductive particles or powder, consisting of photosetting resin and conductive metal, is coated with a thermoplastic or thermosetting insulating adhesive. Then components can be mounted on the printed circuit board by thermal compression bonding, without using solder or an anisotropic conductive adhesive to prevent terminal from short-circuiting, and the components can be satisfactorily mounted, while being insulated through easy positioning.
申请公布号 JPH03152992(A) 申请公布日期 1991.06.28
申请号 JP19890281595 申请日期 1989.10.27
申请人 W R GRACE & CO 发明人 HAGIWARA YOSHICHI
分类号 H05K3/28;H05K1/09;H05K1/18;H05K3/10;H05K3/24;H05K3/30;H05K3/32 主分类号 H05K3/28
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