| 摘要 |
<p>PURPOSE:To lower resistance and improve adhesion with base plate and oxidation resistance of surface by laminating first to third metal layers on a base plate, and forming the respective layers by use of specified metal materials. CONSTITUTION:First to third metals are laminated on an insulating base plate to form a wiring layer structure. As the metal of the first layer, one of cupronickel, chromium, nickel, tantalum, titanium, aluminium, molybdenum, and tungsten is used, as the metal material of the second layer, copper is used, and as the metal material of the third layer, the same metal material as the metal material of the first layer is used. Hence, a wiring layer structure having a remarkably low resistance and improved in adhesion with the insulating base plate and oxidation resistance of the surface is provided.</p> |
